First International Workshop on Pervasive Systems Integration (PerSysT 2018)

(co-located with IEEE PerCom 2018)

Our environment will be soon filled with smart devices and pervasive platforms. However, most systems are not conceived together and not even purchased as monolithic pieces of software and hardware anymore. Different components of end-to-end pervasive systems, built separately, end up sharing the same environment.

Thus, because of a lack of standards and cooperation between providers, the deployment of innovative services is today rather anarchic. This results in highly heterogeneous and sometimes incoherent installations, leading to major issues in terms of service efficiency and software maintenance. In addition, most objects in our environment have a significant longer lifetime than usual software applications. While our heating, smart grid, and air conditioning will easily last 20 years, we continuously upgrade application software, the operating system and the underlying hardware in much shorter terms. This reinforces the need for well-established integration solution between heterogeneous pervasive systems evolving at different paces.

The purpose of this workshop is thus to bring together academic and industrial researchers to discuss and outline challenges, solutions and roadmap when pervasive systems of systems, possibly with different paradigms and from different epochs, have to interoperate, integrate and coordinate. Precisely, the goal of the workshop is to define and develop architectures, models and algorithms enabling interoperability in pervasive environments. It is also to develop a roadmap for this future research area and establish this workshop as an intellectual magnet for industry and academia to find future integrative, inter-operative, cross-correlated and cross-domain approaches and solutions.

We will accept contributions in the below-specified topics, but additional topics related to pervasive systems integration are welcome as well:

  • Integration of application services
  • Integration of sensory devices
  • Interoperability and interdependence of heterogeneous platforms and technologies
  • Integration and interdependence of cross-domain pervasive systems
  • Impact of system/application integration on end-to-end Quality of Service
  • Integration of protocols
  • Impact of system integration on device power
  • Impact of mobility on system/application integration
  • Fundamental principles of system/application integration
  • Retrofitting and sustainability principles for heterogeneous systems

Important Dates

Workshop paper submissions: December 1, 2017 (extended)
Workshop paper notifications: December 23, 2017
Camera ready: January 12, 2018

Submission and Registration

This workshop solicits unpublished and original work that is not under review at other venues. Workshop papers will be included and indexed in the IEEE digital libraries (Xplore). Each accepted workshop paper requires a full PerCom registration (no registration is available for workshops only) and has to be presented in person at the workshop. Workshop papers can be up to 6 pages in the IEEE conference format.


  • Co-Chairs
    • Christian Becker
      University of Mannheim
    • Philippe Lalanda
      University of Grenoble
    • Klara Nahrstedt
      University of Illinois Urbana-Champaign

  • Technical Program Committee
    • David Bromberg, University of Rennes, France
    • Romit Choudhoury, University of Illinois, Urbana-Champaign, USA
    • Charles Consel, University of Bordeaux, France
    • Joao P. de Sousa, Bezirk, USA
    • Carsten Griwodz, University of Oslo, Norway
    • Teruo Higashino, Osaka University, Japan
    • Cheng-Shin Hsu, National Tsing Hua University, Taiwan Nalini
    • Christine Julien, University of Texas, Austin, USA
    • Spyros Lalis, University of Thessaly, Greece
    • Baochun Li, University of Toronto, USA
    • Cecilia Mascolo, University of Cambridge, GB
    • Amy Murphy, Bruno Kessler Foundation, Italy
    • Max Muehlhaeuser, Technische Universitaet Darmstadt, Germany
    • Joerg Nolte, Brandenburg University of Technology, Germany
    • Gian Pietro Picco, University of Trento, Italy
    • Gregor Schiele, University of Duisburg-Essen, Germany
    • Zili Shao, The Hong Kong Polytechnic University, Hong Kong
    • Hirozumi Yamagutchi, Osaka University, Japan
    • Keiji Yasumoto, NAIST, Japan
    • Na Yu, Samsung Research, USA
    • Arkady Zaslavski, CSIRO, Australia

Workshop Program


Hotel and Venue Information